The Hong Kong Monetary Authority (HKMA), acting for the Hong Kong Special Administrative Region Government, has scheduled a tender of HKD 1.5 billion in one year notes under the Infrastructure Bond Programme for 11 November 2026. Settlement is scheduled for 12 November 2026, with maturity on 12 November 2027. The notes will pay interest linked to the Hong Kong Dollar Overnight Index Average (HONIA), payable quarterly in arrears. While the programme also includes retail infrastructure bonds due in 2027, participation in this tender is restricted to appointed primary dealers. Other investors may apply through those dealers. Each tender must be for HKD 50,000 or an integral multiple thereof.

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