The Hong Kong Monetary Authority reported that participating banks have approved seven pilot credit cases under the Intellectual Property Financing Sandbox, with loans ranging from HKD 1 million to HKD 39 million. The cases span electronics, construction, toy manufacturing and medical devices, and will fund working capital, business expansion and market promotion. Launched with the Commerce and Economic Development Bureau and Intellectual Property Department in December 2025, the sandbox allows three major banks to test IP financing in a risk controlled environment. Banks incorporated independent valuations of patents and trademarks into credit assessments, enabling them to offer higher loan amounts or more favorable interest rates and expand financing options for small and medium enterprises with substantial IP assets. The pilots identified scope to strengthen funding support for IP related professional fees, streamline valuation processes, and improve market awareness and professional capabilities across the financing ecosystem.